Fmoc-Phe-Wang Resin for C-Terminal Phenylalanine Peptides
SHBC Fmoc-Phe-Wang Resin is a preloaded solid support designed for Fmoc solid-phase peptide synthesis (Fmoc SPPS) of peptide acids containing C-terminal phenylalanine.
The resin combines Fmoc-protected phenylalanine with an acid-labile Wang linker on a 1% DVB-crosslinked polystyrene matrix. It is supplied with a loading range of 0.3–0.8 mmol/g and a particle size of 100–200 mesh.
Product Specifications
Parameter | Specification |
|---|
Product Name | Fmoc-Phe-Wang Resin |
Brand | SHBC |
Manufacturer | Shanghai SanYu Biotechnology Co., Ltd. |
Product Type | Preloaded Wang Resin |
Preloaded Amino Acid | Fmoc-Phe-OH |
Matrix | Crosslinked Polystyrene |
Linker | Wang Linker |
Loading | 0.3–0.8 mmol/g |
Particle Size | 100–200 Mesh |
Crosslinking | 1% DVB |
Synthesis Strategy | Fmoc SPPS |
Application | Peptide / Protein Synthesis |
CAS No. | 286460-71-7 |
Key Advantages of SHBC Fmoc-Phe-Wang Resin
Ready-to-Use Preloaded Support
Phenylalanine is preloaded onto the Wang resin, reducing the need for a separate initial amino acid loading step during peptide synthesis.
Designed for C-Terminal Phenylalanine Peptides
The resin is suitable for preparing peptide acids in which phenylalanine is required as the C-terminal amino acid residue.
Compatible with Fmoc SPPS
Fmoc-Phe-Wang Resin can be incorporated into standard Fmoc solid-phase peptide synthesis workflows involving repeated Fmoc deprotection, amino acid coupling and washing cycles.
Flexible Loading Range
A loading range of 0.3–0.8 mmol/g provides flexibility for different peptide sequences and synthesis requirements.
100–200 Mesh Resin
The 100–200 mesh particle size provides a practical format for resin swelling, reagent contact, washing and filtration during solid-phase peptide synthesis.
Applications
SHBC Fmoc-Phe-Wang Resin is suitable for:
Fmoc solid-phase peptide synthesis
C-terminal phenylalanine peptide synthesis
Peptide acid preparation
Research peptide synthesis
Protein fragment synthesis
Peptide library preparation
Modified peptide research
Peptide process development
Fmoc-Phe-Wang Resin in Solid-Phase Peptide Synthesis
Fmoc-Phe-Wang Resin provides a preloaded starting support for peptide sequences requiring phenylalanine at the C-terminus.
During Fmoc SPPS, the Fmoc protecting group is removed before coupling the next protected amino acid. Repeated deprotection and coupling cycles extend the peptide chain while it remains attached to the solid support.
After synthesis, validated acidic cleavage conditions are used to release the target peptide from the Wang linker.
Choosing the Right Resin Loading
Resin loading can influence synthesis capacity and reagent accessibility.
The available 0.3–0.8 mmol/g loading range allows researchers to select an appropriate specification according to peptide length, sequence complexity and synthesis scale.
For demanding or aggregation-prone sequences, pilot-scale evaluation is recommended before larger batch synthesis.
Quality and Storage
Recommended quality parameters may include:
Store the resin tightly sealed in a cool, dry environment according to the product label and SDS. Protect from moisture and contamination.
Frequently Asked Questions
What is Fmoc-Phe-Wang Resin used for?
It is used as a preloaded solid support for Fmoc SPPS, particularly for peptide acids requiring phenylalanine as the C-terminal residue.
What is the loading of SHBC Fmoc-Phe-Wang Resin?
The available loading range is 0.3–0.8 mmol/g.
What is the particle size?
The resin is supplied as 100–200 mesh.
What is the DVB crosslinking level?
The polystyrene resin matrix uses 1% DVB crosslinking.
Is Fmoc-Phe-Wang Resin suitable for Fmoc SPPS?
Yes. It is designed for use in Fmoc solid-phase peptide synthesis workflows.
What applications is this resin suitable for?
It can be used for peptide synthesis, protein fragment synthesis, peptide libraries, research peptides and related solid-phase synthesis applications.
What brand is Fmoc-Phe-Wang Resin?
This product is supplied under the SHBC brand by Shanghai SanYu Biotechnology Co., Ltd.