300um Spacer PS Microspheres PAPS300UM 10%

300um Spacer PS Microspheres PAPS300UM

SHBC PAPS300UM are precision 300 μm polystyrene microspheres developed for large-gap control, bond-line thickness control and component spacing.

The spherical polymer particles form physical support points between bonded surfaces. They are suitable for adhesives, camera modules, optical components, sensors, electronic packaging and precision assembly.

Product Specifications

Batch-specific particle size distribution, solid content, supply form, packaging and storage conditions are provided in the product specification and Certificate of Analysis.

Key Advantages

Controlled 300 μm Spacing

The nominal particle diameter helps maintain a defined gap between components, substrates and bonded surfaces.

Uniform Spherical Morphology

Regular spherical particles provide stable support points and help reduce local bond-line variation.

Controlled Particle Size Distribution

Consistent particle sizing supports repeatable thickness control and assembly performance.

Smooth Particle Surface

The smooth surface supports distribution in compatible adhesives, sealants, coatings and polymer systems.

Lightweight Polymer Spacer

The polystyrene structure provides a lightweight alternative to many inorganic spacing materials.

Reliable Bulk Supply

SHBC supports laboratory samples, pilot orders, customized specifications and bulk production.

Main Applications

Adhesive Bond-Line Control

PAPS300UM can be mixed into compatible adhesives or sealants to help maintain an approximately 300 μm bonding gap.

Camera Module Assembly

Used to control adhesive thickness and component spacing in camera and imaging modules.

Optical Component Bonding

Suitable for spacing between lenses, filters, glass substrates, optical housings and precision optical components.

Sensor and Enclosure Assembly

Can be evaluated in sensors and electronic enclosures requiring controlled adhesive thickness.

Electronic Component Mounting

Suitable for inductors, circuit boards, housings, connectors and components requiring a defined assembly gap.

Semiconductor and Power Module Packaging

Can be evaluated for gap control between substrates, packages and supporting components.

Prototype and Test Assemblies

Suitable for laboratory fixtures and material systems requiring repeatable large-gap spacing.

How 300um Spacer Microspheres Work

PAPS300UM microspheres are dispersed in an adhesive, coating or compatible carrier.

During assembly, the particles form physical support points between two surfaces. Their nominal diameter limits excessive compression and helps control the separation distance.

The final bond-line thickness may also depend on:

• Mean particle diameter

• Maximum particle diameter

• Particle size distribution

• Microsphere concentration

• Adhesive viscosity

• Assembly pressure

• Substrate flatness

Product Benefits

PAPS300UM helps provide:

• Controlled 300 μm spacing

• More uniform bond-line thickness

• Consistent support-point distribution

• Reduced local gap variation

• Improved component alignment

• Repeatable assembly processes

• Customized particle specifications

• Scalable industrial supply

Adhesive Processing Guide

Disperse the microspheres evenly in the adhesive before dispensing, coating or bonding.

Important processing factors include:

• Adhesive compatibility

• Microsphere loading

• Adhesive viscosity

• Mixing speed

• Dispensing equipment

• Bonding area

• Assembly pressure

• Required support-point density

Gentle mechanical mixing is recommended to minimize air introduction. Avoid excessive mixing that may create bubbles or damage the adhesive formulation.

Particle Loading Considerations

The recommended particle concentration depends on the bonding area, adhesive volume and required number of support points.

Insufficient loading may produce uneven gap control. Excessive loading may affect adhesive flow, dispensing performance and bond strength.

Customers should evaluate:

• Particle dispersion

• Particle settling

• Adhesive flow

• Dispensing stability

• Final bond-line thickness

• Bond strength

• Long-term compatibility

Process validation is recommended before production use.

How to Select PAPS300UM

Consider the following factors when selecting 300um spacer microspheres:

• Target bond-line thickness

• Mean particle diameter

• Maximum particle diameter

• Particle size tolerance

• Adhesive chemistry

• Adhesive viscosity

• Dispensing method

• Assembly pressure

• Operating temperature

A controlled particle size distribution is recommended when precise and repeatable spacing is required.

Custom Spacer Microspheres

SHBC can customize spacer microspheres according to specific project requirements.

Available options may include:

• Custom particle diameter

• Particle size tolerance

• Particle size distribution

• Solid content

• Dispersion medium

• Surface treatment

• Dry powder or suspension

• Custom packaging

• OEM and ODM supply

Please provide the target gap, adhesive system, application and required quantity when requesting customization.

Quality Control and Documents

Available product documents may include:

• Certificate of Analysis

• Technical Data Sheet

• Safety Data Sheet

• Particle size test report

• Particle size distribution data

• Batch inspection record

• Customized specification sheet

Why Choose SHBC?

Shanghai SanYu Biotechnology Co., Ltd. supplies polymer microspheres, silica microspheres, magnetic beads and functional microsphere materials.

SHBC provides:

• Precision particle manufacturing

• Stable batch-to-batch quality

• Multiple particle-size options

• Customized specifications

• Sample evaluation support

• Pilot-scale production

• Bulk manufacturing capability

• OEM and ODM services

Frequently Asked Questions

What are PAPS300UM microspheres?

PAPS300UM are nominal 300 μm polystyrene microspheres designed for large-gap and bond-line thickness control.

What are 300um spacer microspheres used for?

They can be evaluated for adhesive bonding, camera modules, optical components, sensors, electronic packaging and component assembly.

Can PAPS300UM create an exact 300 μm gap?

The nominal diameter helps control the gap. Final thickness also depends on particle distribution, adhesive properties, particle loading and assembly pressure.

Can PAPS300UM be mixed into epoxy adhesives?

Yes. PAPS300UM can be evaluated in compatible epoxy, UV-curable adhesive, silicone, sealant and other polymer systems.

How much PAPS300UM should be added?

The recommended concentration depends on the bonding area, adhesive volume, viscosity, dispensing method and required support-point density.

Will the particles affect adhesive performance?

Particle loading and dispersion may affect adhesive flow, dispensing and bond strength. Compatibility testing is recommended.

Can SHBC customize the specifications?

Yes. Particle diameter, size tolerance, solid content, dispersion medium, supply form and packaging can be customized.

Are samples and bulk quantities available?

Yes. SHBC supports laboratory samples, pilot-scale orders and long-term bulk supply.

Request a Sample or Quotation

Contact SHBC for PAPS300UM samples, technical specifications, customized spacer microspheres and bulk pricing.

Please provide:

• Target application

• Required gap thickness

• Adhesive or carrier system

• Required quantity

• Preferred supply form

• Packaging requirements

• Estimated annual demand

Product: 300um Spacer PS Microspheres
Catalog Number: PAPS300UM
Material: Polystyrene, PS
Nominal Particle Size: 300 μm
Brand: SHBC
Manufacturer: Shanghai SanYu Biotechnology Co., Ltd.