
Products
SHBC provides colored microspheres, fluorescent microspheres, magnetic beads, silica microspheres, chromatography packing microspheres and biological reagents for diagnostic assay development, nucleic acid extraction, protein purification and separation applications.
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PAPS30UM
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SHBC
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10%
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30µm
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5g 10g 50g 100g 1000g
30um Spacer PS Microspheres PAPS30UM
SHBC PAPS30UM are precision 30 μm polystyrene microspheres developed for gap control, bond-line thickness control and component spacing.
The uniform spherical particles form physical support points between substrates or bonded components. PAPS30UM can be evaluated for adhesives, electronic packaging, optical components, display materials, smart glass and precision assembly.
Product Specifications
Parameter | Specification |
|---|---|
Product Name | Spacer PS Microspheres |
Catalog Number | PAPS30UM |
Material | Polystyrene, PS |
Nominal Particle Size | 30 μm |
Solid Content | 10% |
Particle Shape | Spherical |
Primary Function | Gap and thickness control |
Brand | SHBC |
Manufacturer | Shanghai SanYu Biotechnology Co., Ltd. |
Batch-specific particle size distribution, solid content, supply form, packaging and storage information are available in the product specification or Certificate of Analysis.
Key Advantages
Controlled 30 μm Spacing
The nominal particle diameter helps create a defined gap between bonded surfaces or functional layers.
Uniform Spherical Morphology
Regular spherical particles provide stable support points and help reduce local thickness variation.
Controlled Particle Size Distribution
Consistent particle sizing supports repeatable gap formation and assembly performance.
Smooth Particle Surface
The smooth surface supports dispersion in compatible adhesives, sealants, coatings and carrier systems.
Stable Polymer Structure
The polystyrene matrix provides physical support during normal bonding and assembly processes.
Scalable Supply
SHBC supports sample evaluation, pilot orders, customized specifications and bulk production.
Main Applications
Adhesive Bond-Line Control
PAPS30UM can be mixed into compatible adhesives and sealants to help maintain an approximately 30 μm bonding gap.
Semiconductor Packaging
Suitable for evaluating adhesive thickness control between chips, substrates and packaging components.
Electronic Component Assembly
Used to maintain controlled spacing between circuit boards, housings, sensors and other components.
Optical Component Bonding
Can be added to optical adhesives to support uniform spacing between lenses, glass, films or other optical parts.
Smart Glass and Display Materials
Suitable for structures requiring controlled separation between glass substrates or functional layers.
Coating Thickness Control
Can be evaluated as a physical thickness-control material in compatible coatings and polymer systems.
How 30um Spacer Microspheres Work
PAPS30UM microspheres are dispersed in an adhesive, coating or compatible carrier.
During assembly, the particles form physical support points between two surfaces. Their nominal diameter helps limit compression and define the final separation distance.
The actual gap may vary according to particle size distribution, particle loading, assembly pressure and material properties.
Benefits for Manufacturers
PAPS30UM helps support:
Controlled 30 μm spacing
Uniform bond-line thickness
Consistent support-point distribution
Reduced local gap variation
Repeatable bonding processes
Improved component alignment
Customized formulation development
Sample-to-bulk scale-up
Adhesive Application Guidance
Disperse the microspheres evenly in the adhesive before dispensing or coating.
Important factors include:
Adhesive compatibility
Particle concentration
Adhesive viscosity
Bonding area
Dispensing method
Assembly pressure
Required support-point density
Target final thickness
Excessive particle loading may affect adhesive flow and dispensing. Insufficient loading may not provide enough support points across the bonding area.
Laboratory validation is recommended before production use.
Dispersion Recommendations
Use gentle mechanical mixing to distribute the particles evenly.
Controlled ultrasonic treatment may be used when compatible with the adhesive or carrier system. Avoid excessive mixing conditions that may introduce air bubbles or affect the formulation.
Customers should evaluate:
Particle settling
Particle aggregation
Dispensing stability
Bond strength
Final bond-line thickness
Long-term material compatibility
Custom Spacer Microspheres
SHBC can customize spacer microspheres according to project requirements.
Available options may include:
Particle diameter
Particle size tolerance
Particle size distribution
Solid content
Dispersion medium
Surface treatment
Dry powder or suspension
Packaging quantity
OEM and ODM supply
Please provide the target gap, adhesive system, application and required quantity when requesting customization.
Quality Control and Documents
SHBC applies controlled manufacturing and batch inspection to support consistent product performance.
Available documents may include:
Certificate of Analysis
Technical Data Sheet
Safety Data Sheet
Particle size test report
Batch inspection record
Customized specification sheet
Why Choose SHBC?
Shanghai SanYu Biotechnology Co., Ltd. manufactures polymer microspheres, silica microspheres, magnetic beads and other functional microsphere materials.
SHBC provides:
Precision particle manufacturing
Stable batch-to-batch quality
Multiple particle-size options
Customized specifications
Sample evaluation support
Pilot-scale supply
Bulk production capability
OEM and ODM services
Frequently Asked Questions
What are PAPS30UM microspheres?
PAPS30UM are nominal 30 μm polystyrene microspheres designed for gap control and bond-line thickness control.
What are 30um spacer microspheres used for?
They can be evaluated for adhesive bonding, semiconductor packaging, electronic assembly, optical components, display materials and smart glass.
Can PAPS30UM create an exact 30 μm gap?
The nominal particle size helps control the gap. The final thickness also depends on particle distribution, loading, adhesive properties and assembly pressure.
Can PAPS30UM be mixed into epoxy?
PAPS30UM can be evaluated in compatible epoxy, UV-curable adhesive, sealant and other polymer systems.
How much PAPS30UM should be added?
The recommended concentration depends on the bonding area, adhesive volume, viscosity, dispensing method and required support-point density. Application testing is required.
Can SHBC customize the particle specifications?
Yes. Particle size, tolerance, solid content, dispersion medium, supply form and packaging can be customized.
Are samples available?
Samples are available for dispersion, compatibility and bonding-process evaluation.
Does SHBC support bulk production?
Yes. SHBC supports laboratory samples, pilot orders and long-term bulk supply.
Request a Sample or Quotation
Contact SHBC for PAPS30UM samples, technical specifications, customized spacer microspheres and bulk pricing.
Please provide:
Target application
Required gap thickness
Adhesive or carrier system
Required quantity
Preferred supply form
Packaging requirements
Estimated annual demand
Product: 30um Spacer PS Microspheres
Catalog Number: PAPS30UM
Material: Polystyrene, PS
Nominal Particle Size: 30 μm
Brand: SHBC
Manufacturer: Shanghai SanYu Biotechnology Co., Ltd.


