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Home Polymer & Latex Microspheres 30um Spacer PS Microspheres PAPS30UM
30um Spacer PS Microspheres PAPS30UM
30um Spacer PS Microspheres PAPS30UM
30um Spacer PS Microspheres PAPS30UM
30um Spacer PS Microspheres PAPS30UM
SHBC 30um spacer polystyrene microspheres PAPS30UM provide uniform particle size and precise gap control for LCD, PDLC, optical films, and electronic assembly.
  • PAPS30UM

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30um Spacer PS Microspheres PAPS30UM

SHBC PAPS30UM are precision 30 μm polystyrene microspheres developed for gap control, bond-line thickness control and component spacing.

The uniform spherical particles form physical support points between substrates or bonded components. PAPS30UM can be evaluated for adhesives, electronic packaging, optical components, display materials, smart glass and precision assembly.

Product Specifications

Parameter

Specification

Product Name

Spacer PS Microspheres

Catalog Number

PAPS30UM

Material

Polystyrene, PS

Nominal Particle Size

30 μm

Particle Shape

Spherical

Primary Function

Gap and thickness control

Brand

SHBC

Manufacturer

Shanghai SanYu Biotechnology Co., Ltd.

Batch-specific particle size distribution, solid content, supply form, packaging and storage information are available in the product specification or Certificate of Analysis.

Key Advantages

Controlled 30 μm Spacing

The nominal particle diameter helps create a defined gap between bonded surfaces or functional layers.

Uniform Spherical Morphology

Regular spherical particles provide stable support points and help reduce local thickness variation.

Controlled Particle Size Distribution

Consistent particle sizing supports repeatable gap formation and assembly performance.

Smooth Particle Surface

The smooth surface supports dispersion in compatible adhesives, sealants, coatings and carrier systems.

Stable Polymer Structure

The polystyrene matrix provides physical support during normal bonding and assembly processes.

Scalable Supply

SHBC supports sample evaluation, pilot orders, customized specifications and bulk production.

Main Applications

Adhesive Bond-Line Control

PAPS30UM can be mixed into compatible adhesives and sealants to help maintain an approximately 30 μm bonding gap.

Semiconductor Packaging

Suitable for evaluating adhesive thickness control between chips, substrates and packaging components.

Electronic Component Assembly

Used to maintain controlled spacing between circuit boards, housings, sensors and other components.

Optical Component Bonding

Can be added to optical adhesives to support uniform spacing between lenses, glass, films or other optical parts.

Smart Glass and Display Materials

Suitable for structures requiring controlled separation between glass substrates or functional layers.

Coating Thickness Control

Can be evaluated as a physical thickness-control material in compatible coatings and polymer systems.

How 30um Spacer Microspheres Work

PAPS30UM microspheres are dispersed in an adhesive, coating or compatible carrier.

During assembly, the particles form physical support points between two surfaces. Their nominal diameter helps limit compression and define the final separation distance.

The actual gap may vary according to particle size distribution, particle loading, assembly pressure and material properties.

Benefits for Manufacturers

PAPS30UM helps support:

  • Controlled 30 μm spacing

  • Uniform bond-line thickness

  • Consistent support-point distribution

  • Reduced local gap variation

  • Repeatable bonding processes

  • Improved component alignment

  • Customized formulation development

  • Sample-to-bulk scale-up

Adhesive Application Guidance

Disperse the microspheres evenly in the adhesive before dispensing or coating.

Important factors include:

  • Adhesive compatibility

  • Particle concentration

  • Adhesive viscosity

  • Bonding area

  • Dispensing method

  • Assembly pressure

  • Required support-point density

  • Target final thickness

Excessive particle loading may affect adhesive flow and dispensing. Insufficient loading may not provide enough support points across the bonding area.

Laboratory validation is recommended before production use.

Dispersion Recommendations

Use gentle mechanical mixing to distribute the particles evenly.

Controlled ultrasonic treatment may be used when compatible with the adhesive or carrier system. Avoid excessive mixing conditions that may introduce air bubbles or affect the formulation.

Customers should evaluate:

  • Particle settling

  • Particle aggregation

  • Dispensing stability

  • Bond strength

  • Final bond-line thickness

  • Long-term material compatibility

Custom Spacer Microspheres

SHBC can customize spacer microspheres according to project requirements.

Available options may include:

  • Particle diameter

  • Particle size tolerance

  • Particle size distribution

  • Solid content

  • Dispersion medium

  • Surface treatment

  • Dry powder or suspension

  • Packaging quantity

  • OEM and ODM supply

Please provide the target gap, adhesive system, application and required quantity when requesting customization.

Quality Control and Documents

SHBC applies controlled manufacturing and batch inspection to support consistent product performance.

Available documents may include:

  • Certificate of Analysis

  • Technical Data Sheet

  • Safety Data Sheet

  • Particle size test report

  • Batch inspection record

  • Customized specification sheet

Why Choose SHBC?

Shanghai SanYu Biotechnology Co., Ltd. manufactures polymer microspheres, silica microspheres, magnetic beads and other functional microsphere materials.

SHBC provides:

  • Precision particle manufacturing

  • Stable batch-to-batch quality

  • Multiple particle-size options

  • Customized specifications

  • Sample evaluation support

  • Pilot-scale supply

  • Bulk production capability

  • OEM and ODM services

Frequently Asked Questions

What are PAPS30UM microspheres?

PAPS30UM are nominal 30 μm polystyrene microspheres designed for gap control and bond-line thickness control.

What are 30um spacer microspheres used for?

They can be evaluated for adhesive bonding, semiconductor packaging, electronic assembly, optical components, display materials and smart glass.

Can PAPS30UM create an exact 30 μm gap?

The nominal particle size helps control the gap. The final thickness also depends on particle distribution, loading, adhesive properties and assembly pressure.

Can PAPS30UM be mixed into epoxy?

PAPS30UM can be evaluated in compatible epoxy, UV-curable adhesive, sealant and other polymer systems.

How much PAPS30UM should be added?

The recommended concentration depends on the bonding area, adhesive volume, viscosity, dispensing method and required support-point density. Application testing is required.

Can SHBC customize the particle specifications?

Yes. Particle size, tolerance, solid content, dispersion medium, supply form and packaging can be customized.

Are samples available?

Samples are available for dispersion, compatibility and bonding-process evaluation.

Does SHBC support bulk production?

Yes. SHBC supports laboratory samples, pilot orders and long-term bulk supply.

Request a Sample or Quotation

Contact SHBC for PAPS30UM samples, technical specifications, customized spacer microspheres and bulk pricing.

Please provide:

  • Target application

  • Required gap thickness

  • Adhesive or carrier system

  • Required quantity

  • Preferred supply form

  • Packaging requirements

  • Estimated annual demand

Product: 30um Spacer PS Microspheres
Catalog Number: PAPS30UM
Material: Polystyrene, PS
Nominal Particle Size: 30 μm
Brand: SHBC
Manufacturer: Shanghai SanYu Biotechnology Co., Ltd.

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