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Home Polymer & Latex Microspheres 40um Spacer PS Microspheres PAPS40UM 10%
40um Spacer PS Microspheres PAPS40UM 10%
40um Spacer PS Microspheres PAPS40UM 10%
40um Spacer PS Microspheres PAPS40UM 10%
40um Spacer PS Microspheres PAPS40UM 10%
SHBC 40um spacer polystyrene microspheres PAPS40UM offer uniform particle size and precise gap control for adhesives, optics, and electronic assembly.
  • PAPS40UM

  • SHBC

  • 10%

  • 40µm

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40um Spacer PS Microspheres PAPS40UM

SHBC PAPS40UM are precision 40 μm polystyrene microspheres developed for bond-line thickness control, component spacing and uniform gap formation.

The spherical polymer particles act as physical support points between bonded surfaces. They are suitable for adhesives, optical components, sensors, smart glass, electronic packaging and precision assembly.

Product Specifications

Parameter

Specification

Product Name

Spacer PS Microspheres

Catalog Number

PAPS40UM

Material

Polystyrene, PS

Nominal Particle Size

40 μm

Solid Content

10%

Particle Shape

Spherical

Main Function

Gap and thickness control

Brand

SHBC

Manufacturer

Shanghai SanYu Biotechnology Co., Ltd.

Particle size distribution, solid content, supply form, packaging and storage conditions are provided according to the final specification and batch Certificate of Analysis.

Key Advantages

Controlled 40 μm Spacing

The nominal particle diameter helps create a defined gap between substrates, components or bonded surfaces.

Uniform Spherical Morphology

Regular spherical particles provide stable support points and help reduce local bond-line variation.

Controlled Particle Distribution

Consistent particle sizing supports repeatable thickness control and assembly performance.

Smooth Particle Surface

The smooth surface supports dispersion in compatible adhesives, sealants, coatings and polymer systems.

Lightweight Polymer Structure

Polystyrene microspheres provide a lower-density alternative to many inorganic spacer particles and may reduce settling in suitable formulations.

Scalable Supply

SHBC supports sample evaluation, pilot orders, customized specifications and bulk production.

Main Applications

Adhesive Bond-Line Control

PAPS40UM can be added to compatible adhesives or sealants to help maintain an approximately 40 μm bond line.

Optical Component Assembly

Used to control spacing between lenses, glass substrates, filters, optical films and other precision components.

Sensor Manufacturing

Suitable for pressure sensors, optical sensors and electronic sensor assemblies requiring controlled adhesive thickness.

Semiconductor Packaging

Can be evaluated for spacing between chips, substrates, circuit components and packaging materials.

Smart Glass and Display Materials

Suitable for glass or film structures requiring uniform separation between functional layers.

Electronic Component Assembly

Used to maintain controlled spacing between circuit boards, housings, connectors and electronic components.

How Spacer Microspheres Work

PAPS40UM microspheres are dispersed in an adhesive, coating or compatible carrier.

During assembly, the particles form physical support points between two surfaces. Their diameter limits excessive compression and helps define the final gap.

The actual bond-line thickness may also be affected by:

  • Particle size distribution

  • Maximum particle diameter

  • Microsphere concentration

  • Adhesive viscosity

  • Assembly pressure

  • Substrate flatness

Benefits for Manufacturers

PAPS40UM helps provide:

  • Controlled 40 μm spacing

  • More uniform adhesive thickness

  • Consistent support-point distribution

  • Reduced local gap variation

  • Improved component alignment

  • Repeatable bonding processes

  • Custom specification options

  • Reliable bulk supply

Adhesive Processing Guide

Disperse the microspheres evenly in the adhesive before dispensing or coating.

Important processing factors include:

  • Adhesive compatibility

  • Particle concentration

  • Adhesive viscosity

  • Mixing speed

  • Dispensing equipment

  • Bonding area

  • Assembly pressure

  • Required support-point density

Gentle mechanical mixing is recommended to reduce air introduction. Controlled ultrasonic dispersion may be used when compatible with the adhesive system.

Particle Loading Considerations

The recommended microsphere concentration depends on the application and bonding area.

Too few particles may provide insufficient support points. Excessive loading may affect adhesive flow, dispensing performance or final bond strength.

Customers should evaluate:

  • Dispersion uniformity

  • Particle settling

  • Adhesive flow

  • Final gap thickness

  • Bond strength

  • Long-term compatibility

Application testing is recommended before production use.

Custom Spacer Microspheres

SHBC can customize spacer microspheres according to specific project requirements.

Available options may include:

  • Particle diameter

  • Particle size tolerance

  • Particle size distribution

  • Solid content

  • Dispersion medium

  • Surface treatment

  • Dry powder or suspension

  • Custom packaging

  • OEM and ODM supply

Please provide the target gap, adhesive system, application and required quantity when requesting customization.

Quality Control and Documents

Available quality documents may include:

  • Certificate of Analysis

  • Technical Data Sheet

  • Safety Data Sheet

  • Particle size test report

  • Batch inspection record

  • Customized specification sheet

Why Choose SHBC?

Shanghai SanYu Biotechnology Co., Ltd. manufactures polymer microspheres, silica microspheres, magnetic beads and functional microsphere materials.

SHBC provides:

  • Precision particle manufacturing

  • Stable batch-to-batch quality

  • Multiple particle-size options

  • Customized product specifications

  • Sample evaluation support

  • Pilot-scale production

  • Bulk manufacturing capability

  • OEM and ODM services

Frequently Asked Questions

What are PAPS40UM microspheres?

PAPS40UM are nominal 40 μm polystyrene microspheres designed for precision gap and bond-line thickness control.

What are 40um spacer microspheres used for?

They can be evaluated for adhesive bonding, optical components, sensors, smart glass, semiconductor packaging and electronic assembly.

Can PAPS40UM produce an exact 40 μm gap?

The nominal particle diameter helps control the gap. Final thickness also depends on particle distribution, adhesive properties, loading and assembly pressure.

Can PAPS40UM be mixed into epoxy adhesives?

Yes. PAPS40UM can be evaluated in compatible epoxy, UV-curable adhesive, silicone, sealant and other polymer systems.

How much PAPS40UM should be added?

The required amount depends on the bonding area, adhesive volume, viscosity, dispensing method and required support-point density.

Can SHBC customize the particle size?

Yes. Particle size, tolerance, solid content, dispersion medium, supply form and packaging can be customized.

Are samples available?

Yes. Samples are available for dispersion, compatibility and bonding-process evaluation.

Does SHBC support bulk production?

Yes. SHBC supports laboratory samples, pilot orders and long-term bulk supply.

Request a Sample or Quotation

Contact SHBC for PAPS40UM samples, technical specifications, customized spacer microspheres and bulk pricing.

Please provide:

  • Target application

  • Required gap thickness

  • Adhesive or carrier system

  • Required quantity

  • Preferred supply form

  • Packaging requirements

  • Estimated annual demand

Product: 40um Spacer PS Microspheres
Catalog Number: PAPS40UM
Material: Polystyrene, PS
Nominal Particle Size: 40 μm
Brand: SHBC
Manufacturer: Shanghai SanYu Biotechnology Co., Ltd.

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