50um Spacer PS Microspheres PAPS50UM 10%

50um Spacer PS Microspheres PAPS50UM

SHBC PAPS50UM are precision 50 μm polystyrene microspheres developed for bond-line thickness control, component spacing and uniform gap formation.

The spherical polymer particles form physical support points between bonded surfaces. They are suitable for adhesives, optical components, sensors, electronic packaging and precision assembly.

Product Specifications

Particle size distribution, solid content, supply form, packaging and storage conditions are available in the product specification and batch Certificate of Analysis.

Key Advantages

Controlled 50 μm Spacing

The nominal particle diameter helps create a defined gap between substrates, components and bonded surfaces.

Uniform Spherical Morphology

Regular spherical particles provide stable support points and help reduce local bond-line variation.

Controlled Particle Size Distribution

Consistent particle sizing supports repeatable thickness control and assembly performance.

Smooth Particle Surface

The smooth surface supports uniform distribution in compatible adhesives, sealants, coatings and polymer systems.

Lightweight Polymer Material

The polystyrene structure provides a lower-density alternative to many inorganic spacer particles.

Reliable Batch Supply

SHBC supports samples, pilot-scale orders, customized specifications and bulk production.

Main Applications

Adhesive Bond-Line Control

PAPS50UM can be mixed into compatible adhesives or sealants to help maintain an approximately 50 μm bonding gap.

Optical Component Assembly

Used to control spacing between lenses, optical filters, glass substrates, films and precision optical components.

Sensor Manufacturing

Suitable for sensor structures requiring controlled adhesive thickness and uniform component separation.

Electronic Packaging

Can be evaluated for spacing between circuit boards, substrates, housings, connectors and electronic components.

Semiconductor Assembly

Suitable for controlling adhesive thickness between chips, substrates and packaging materials.

Smart Glass and Display Materials

Can be used in glass and film structures requiring controlled separation between functional layers.

How 50um Spacer Microspheres Work

PAPS50UM microspheres are dispersed in an adhesive, coating or compatible carrier.

During assembly, the particles form physical support points between two surfaces. Their nominal diameter limits excessive compression and helps define the final gap.

The actual bond-line thickness may also depend on:

• Particle size distribution

• Maximum particle diameter

• Particle concentration

• Adhesive viscosity

• Assembly pressure

• Substrate flatness

Benefits for Manufacturers

PAPS50UM helps support:

• Controlled 50 μm spacing

• Uniform adhesive thickness

• Consistent support-point distribution

• Reduced local gap variation

• Improved component alignment

• Repeatable bonding processes

• Customized product development

• Sample-to-bulk scale-up

Adhesive Processing Guide

Disperse the microspheres evenly in the adhesive before dispensing, coating or bonding.

Important processing factors include:

• Adhesive compatibility

• Microsphere loading

• Adhesive viscosity

• Mixing speed

• Dispensing equipment

• Bonding area

• Assembly pressure

• Required support-point density

Gentle mechanical mixing is recommended to reduce air introduction. Controlled ultrasonic dispersion may be evaluated when compatible with the adhesive system.

Particle Loading Considerations

The recommended particle concentration depends on the bonding area, adhesive volume and required support-point density.

Insufficient particle loading may not provide enough support across the bonding area. Excessive loading may affect adhesive flow, dispensing performance and bond strength.

Customers should evaluate:

• Dispersion uniformity

• Particle settling

• Adhesive flow

• Dispensing stability

• Final bond-line thickness

• Bond strength

• Long-term compatibility

Process validation is recommended before production use.

How to Select Spacer Microspheres

Consider the following factors when selecting PAPS50UM:

• Target bond-line thickness

• Particle size tolerance

• Adhesive chemistry

• Adhesive viscosity

• Dispensing method

• Assembly pressure

• Substrate material

• Operating temperature

A narrow particle size distribution is recommended when precise and repeatable gap control is required.

Custom Spacer Microspheres

SHBC can customize spacer microspheres according to specific project requirements.

Available options may include:

• Custom particle diameter

• Particle size tolerance

• Particle size distribution

• Solid content

• Dispersion medium

• Surface treatment

• Dry powder or suspension

• Custom packaging

• OEM and ODM supply

Please provide the target gap, adhesive system, application and required quantity when requesting customization.

Quality Control and Documents

SHBC applies controlled manufacturing and batch inspection to support consistent product performance.

Available documents may include:

• Certificate of Analysis

• Technical Data Sheet

• Safety Data Sheet

• Particle size test report

• Particle size distribution data

• Batch inspection record

• Customized specification sheet

Why Choose SHBC?

Shanghai SanYu Biotechnology Co., Ltd. manufactures polymer microspheres, silica microspheres, magnetic beads and functional microsphere materials.

SHBC provides:

• Precision particle manufacturing

• Stable batch-to-batch quality

• Multiple particle-size options

• Customized product specifications

• Sample evaluation support

• Pilot-scale production

• Bulk manufacturing capability

• OEM and ODM services

Frequently Asked Questions

What are PAPS50UM microspheres?

PAPS50UM are nominal 50 μm polystyrene microspheres designed for precision gap and bond-line thickness control.

What are 50um spacer microspheres used for?

They can be evaluated for adhesive bonding, optical components, sensors, electronic packaging, semiconductor assembly and smart glass.

Can PAPS50UM create an exact 50 μm gap?

The nominal particle diameter helps control the gap. Final thickness also depends on particle size distribution, loading, adhesive properties and assembly pressure.

Can PAPS50UM be mixed into epoxy adhesives?

Yes. PAPS50UM can be evaluated in compatible epoxy, UV-curable adhesive, silicone, sealant and other polymer systems.

How much PAPS50UM should be added?

The recommended amount depends on the bonding area, adhesive volume, viscosity, dispensing method and required support-point density.

Will the microspheres affect adhesive strength?

Spacer loading and dispersion may influence adhesive flow and bonding performance. Compatibility testing and process validation are recommended.

Can SHBC customize the particle size?

Yes. Particle size, tolerance, solid content, dispersion medium, supply form and packaging can be customized.

Are samples and bulk quantities available?

Yes. SHBC supports laboratory samples, pilot-scale orders and long-term bulk supply.

Request a Sample or Quotation

Contact SHBC for PAPS50UM samples, technical specifications, customized spacer microspheres and bulk pricing.

Please provide:

• Target application

• Required gap thickness

• Adhesive or carrier system

• Required quantity

• Preferred supply form

• Packaging requirements

• Estimated annual demand

Product: 50um Spacer PS Microspheres
Catalog Number: PAPS50UM
Material: Polystyrene, PS
Nominal Particle Size: 50 μm
Brand: SHBC
Manufacturer: Shanghai SanYu Biotechnology Co., Ltd.