
Products
SHBC provides colored microspheres, fluorescent microspheres, magnetic beads, silica microspheres, chromatography packing microspheres and biological reagents for diagnostic assay development, nucleic acid extraction, protein purification and separation applications.
-
PAPS600UM
-
SHBC
-
600µm
-
5g 10g 50g 100g 1000g
600um Spacer PS Microspheres PAPS600UM
SHBC PAPS600UM are 600 μm polystyrene microspheres designed for large-gap control, bond-line thickness control and precision component spacing.
The spherical polymer particles form physical support points between assembled surfaces. They can be evaluated in adhesives, sealants, optical assemblies, sensors, electronic modules and industrial components.
Product Specifications
Parameter | Specification |
|---|---|
Product Name | Spacer PS Microspheres |
Catalog Number | PAPS600UM |
Material | Polystyrene, PS |
Nominal Particle Size | 600 μm |
Particle Shape | Spherical |
Main Function | Large-gap and thickness control |
Brand | SHBC |
Manufacturer | Shanghai SanYu Biotechnology Co., Ltd. |
Batch-specific particle size, particle size distribution, supply form, packaging and storage information are available in the product specification and Certificate of Analysis.
Key Advantages
Controlled 600 μm Spacing
The nominal particle diameter helps maintain an approximately 600 μm separation between bonded surfaces.
Uniform Spherical Structure
Spherical particles provide stable support points and help reduce local bond-line variation.
Consistent Particle Sizing
Controlled particle sizing supports repeatable gap control and assembly performance.
Lightweight Polymer Material
Polystyrene provides a lightweight alternative to many glass and inorganic spacer materials.
Easy Application Evaluation
PAPS600UM can be evaluated in compatible adhesives, sealants, coatings and resin systems.
Custom and Bulk Supply
SHBC supports samples, customized specifications, pilot orders and bulk production.
Main Applications
Adhesive Bond-Line Control
PAPS600UM can be dispersed in compatible adhesives to help maintain a defined 600 μm bond line.
Electronic Module Assembly
Suitable for controlling spacing between circuit boards, substrates, housings and supporting components.
Sensor and Enclosure Bonding
Can be evaluated in sensors and electronic enclosures requiring controlled adhesive thickness.
Optical Component Assembly
Suitable for spacing between lenses, filters, glass substrates, optical housings and imaging components.
Industrial Component Bonding
Used in mechanical parts, fixtures and industrial assemblies requiring repeatable separation.
Coating and Resin Thickness Control
Can serve as a physical spacer in compatible coatings, resins and composite systems.
Prototype and Testing Systems
Suitable for laboratory fixtures, test assemblies and material evaluation requiring a controlled large gap.
How 600um Spacer Microspheres Work
PAPS600UM microspheres are distributed in an adhesive, coating or compatible carrier.
During assembly, the particles form support points between two surfaces. Their nominal diameter helps limit excessive compression and maintain the required separation.
Final gap thickness may also depend on:
Mean particle diameter
Maximum particle diameter
Particle size distribution
Particle loading
Adhesive viscosity
Assembly pressure
Substrate flatness
Product Benefits
PAPS600UM helps provide:
Controlled large-gap spacing
More uniform bond-line thickness
Stable support-point distribution
Reduced local gap variation
Improved component alignment
Repeatable assembly processes
Customized particle specifications
Reliable industrial supply
Processing Recommendations
Disperse the particles evenly in the adhesive before dispensing or bonding.
Recommended processing considerations include:
Confirm adhesive compatibility
Use gentle mechanical mixing
Minimize air and bubble formation
Evaluate particle settling
Select suitable dispensing equipment
Control assembly pressure
Validate the final bond-line thickness
The dispensing nozzle and material path must be sufficiently larger than 600 μm to reduce the risk of particle blockage.
Particle Loading Considerations
The appropriate particle concentration depends on the bonding area, adhesive volume and required number of support points.
Low loading may produce insufficient support. Excessive loading may affect adhesive flow, dispensing performance and bond strength.
Evaluate particle dispersion, adhesive viscosity, dispensing stability and final bonding performance before production.
How to Select PAPS600UM
Consider the following factors:
Target gap thickness
Mean and maximum particle diameter
Particle size tolerance
Adhesive chemistry
Adhesive viscosity
Dispensing method
Assembly pressure
Operating environment
PAPS600UM is recommended for applications requiring a nominal spacing of approximately 600 μm.
Custom Spacer Microspheres
SHBC can customize spacer microspheres according to specific application requirements.
Customization options may include:
Particle diameter
Particle size tolerance
Particle size distribution
Solid content
Dispersion medium
Surface treatment
Dry powder or suspension
Packaging size
OEM and ODM supply
Please provide the target gap, adhesive system, application and required quantity when requesting customization.
Quality Control and Documents
Available product documents may include:
Certificate of Analysis
Technical Data Sheet
Safety Data Sheet
Particle size test report
Particle size distribution data
Batch inspection record
Customized specification sheet
Why Choose SHBC?
Shanghai SanYu Biotechnology Co., Ltd. supplies polymer microspheres, silica microspheres, magnetic beads and functional particle materials.
SHBC provides:
Precision particle manufacturing
Stable batch quality
Multiple particle-size options
Customized specifications
Sample evaluation support
Pilot-scale production
Bulk manufacturing
OEM and ODM services
Frequently Asked Questions
What are PAPS600UM microspheres?
PAPS600UM are nominal 600 μm polystyrene microspheres designed for large-gap and bond-line thickness control.
What applications are suitable for PAPS600UM?
They can be evaluated for adhesive bonding, electronic modules, optical components, sensors, enclosures and industrial assemblies.
Can PAPS600UM create an exact 600 μm gap?
The nominal particle diameter helps control the gap. Final thickness also depends on particle distribution, adhesive properties, loading and assembly pressure.
Can PAPS600UM be added to epoxy adhesives?
Yes. They can be evaluated in compatible epoxy, UV-curable adhesive, silicone, sealant and other polymer systems.
Can the particles pass through dispensing equipment?
The nozzle and material path must be larger than the particle diameter. Equipment compatibility should be confirmed before use.
How much PAPS600UM should be added?
The recommended concentration depends on the bonding area, adhesive volume and required support-point density.
Can SHBC customize the particle size?
Yes. Particle diameter, tolerance, supply form, solid content and packaging can be customized.
Are samples and bulk quantities available?
Yes. SHBC supports sample evaluation, pilot orders and long-term bulk supply.
Request a Sample or Quotation
Contact SHBC for PAPS600UM samples, technical specifications, custom spacer microspheres and bulk pricing.
Please provide:
Target application
Required gap thickness
Adhesive or carrier system
Required quantity
Preferred supply form
Packaging requirements
Estimated annual demand
Product: 600um Spacer PS Microspheres
Catalog Number: PAPS600UM
Material: Polystyrene, PS
Nominal Particle Size: 600 μm
Brand: SHBC
Manufacturer: Shanghai SanYu Biotechnology Co., Ltd.


