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Home Polymer & Latex Microspheres 600um Spacer Polystyrene Microspheres PAPS600UM
600um Spacer Polystyrene Microspheres PAPS600UM
600um Spacer Polystyrene Microspheres PAPS600UM
600um Spacer Polystyrene Microspheres PAPS600UM
600um Spacer Polystyrene Microspheres PAPS600UM
SHBC 600um spacer polystyrene microspheres PAPS600UM provide uniform particle size and precise gap control for adhesives, optics, sensors, and electronics.
  • PAPS600UM

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600um Spacer PS Microspheres PAPS600UM

SHBC PAPS600UM are 600 μm polystyrene microspheres designed for large-gap control, bond-line thickness control and precision component spacing.

The spherical polymer particles form physical support points between assembled surfaces. They can be evaluated in adhesives, sealants, optical assemblies, sensors, electronic modules and industrial components.

Product Specifications

Parameter

Specification

Product Name

Spacer PS Microspheres

Catalog Number

PAPS600UM

Material

Polystyrene, PS

Nominal Particle Size

600 μm

Particle Shape

Spherical

Main Function

Large-gap and thickness control

Brand

SHBC

Manufacturer

Shanghai SanYu Biotechnology Co., Ltd.

Batch-specific particle size, particle size distribution, supply form, packaging and storage information are available in the product specification and Certificate of Analysis.

Key Advantages

Controlled 600 μm Spacing

The nominal particle diameter helps maintain an approximately 600 μm separation between bonded surfaces.

Uniform Spherical Structure

Spherical particles provide stable support points and help reduce local bond-line variation.

Consistent Particle Sizing

Controlled particle sizing supports repeatable gap control and assembly performance.

Lightweight Polymer Material

Polystyrene provides a lightweight alternative to many glass and inorganic spacer materials.

Easy Application Evaluation

PAPS600UM can be evaluated in compatible adhesives, sealants, coatings and resin systems.

Custom and Bulk Supply

SHBC supports samples, customized specifications, pilot orders and bulk production.

Main Applications

Adhesive Bond-Line Control

PAPS600UM can be dispersed in compatible adhesives to help maintain a defined 600 μm bond line.

Electronic Module Assembly

Suitable for controlling spacing between circuit boards, substrates, housings and supporting components.

Sensor and Enclosure Bonding

Can be evaluated in sensors and electronic enclosures requiring controlled adhesive thickness.

Optical Component Assembly

Suitable for spacing between lenses, filters, glass substrates, optical housings and imaging components.

Industrial Component Bonding

Used in mechanical parts, fixtures and industrial assemblies requiring repeatable separation.

Coating and Resin Thickness Control

Can serve as a physical spacer in compatible coatings, resins and composite systems.

Prototype and Testing Systems

Suitable for laboratory fixtures, test assemblies and material evaluation requiring a controlled large gap.

How 600um Spacer Microspheres Work

PAPS600UM microspheres are distributed in an adhesive, coating or compatible carrier.

During assembly, the particles form support points between two surfaces. Their nominal diameter helps limit excessive compression and maintain the required separation.

Final gap thickness may also depend on:

  • Mean particle diameter

  • Maximum particle diameter

  • Particle size distribution

  • Particle loading

  • Adhesive viscosity

  • Assembly pressure

  • Substrate flatness

Product Benefits

PAPS600UM helps provide:

  • Controlled large-gap spacing

  • More uniform bond-line thickness

  • Stable support-point distribution

  • Reduced local gap variation

  • Improved component alignment

  • Repeatable assembly processes

  • Customized particle specifications

  • Reliable industrial supply

Processing Recommendations

Disperse the particles evenly in the adhesive before dispensing or bonding.

Recommended processing considerations include:

  • Confirm adhesive compatibility

  • Use gentle mechanical mixing

  • Minimize air and bubble formation

  • Evaluate particle settling

  • Select suitable dispensing equipment

  • Control assembly pressure

  • Validate the final bond-line thickness

The dispensing nozzle and material path must be sufficiently larger than 600 μm to reduce the risk of particle blockage.

Particle Loading Considerations

The appropriate particle concentration depends on the bonding area, adhesive volume and required number of support points.

Low loading may produce insufficient support. Excessive loading may affect adhesive flow, dispensing performance and bond strength.

Evaluate particle dispersion, adhesive viscosity, dispensing stability and final bonding performance before production.

How to Select PAPS600UM

Consider the following factors:

  • Target gap thickness

  • Mean and maximum particle diameter

  • Particle size tolerance

  • Adhesive chemistry

  • Adhesive viscosity

  • Dispensing method

  • Assembly pressure

  • Operating environment

PAPS600UM is recommended for applications requiring a nominal spacing of approximately 600 μm.

Custom Spacer Microspheres

SHBC can customize spacer microspheres according to specific application requirements.

Customization options may include:

  • Particle diameter

  • Particle size tolerance

  • Particle size distribution

  • Solid content

  • Dispersion medium

  • Surface treatment

  • Dry powder or suspension

  • Packaging size

  • OEM and ODM supply

Please provide the target gap, adhesive system, application and required quantity when requesting customization.

Quality Control and Documents

Available product documents may include:

  • Certificate of Analysis

  • Technical Data Sheet

  • Safety Data Sheet

  • Particle size test report

  • Particle size distribution data

  • Batch inspection record

  • Customized specification sheet

Why Choose SHBC?

Shanghai SanYu Biotechnology Co., Ltd. supplies polymer microspheres, silica microspheres, magnetic beads and functional particle materials.

SHBC provides:

  • Precision particle manufacturing

  • Stable batch quality

  • Multiple particle-size options

  • Customized specifications

  • Sample evaluation support

  • Pilot-scale production

  • Bulk manufacturing

  • OEM and ODM services

Frequently Asked Questions

What are PAPS600UM microspheres?

PAPS600UM are nominal 600 μm polystyrene microspheres designed for large-gap and bond-line thickness control.

What applications are suitable for PAPS600UM?

They can be evaluated for adhesive bonding, electronic modules, optical components, sensors, enclosures and industrial assemblies.

Can PAPS600UM create an exact 600 μm gap?

The nominal particle diameter helps control the gap. Final thickness also depends on particle distribution, adhesive properties, loading and assembly pressure.

Can PAPS600UM be added to epoxy adhesives?

Yes. They can be evaluated in compatible epoxy, UV-curable adhesive, silicone, sealant and other polymer systems.

Can the particles pass through dispensing equipment?

The nozzle and material path must be larger than the particle diameter. Equipment compatibility should be confirmed before use.

How much PAPS600UM should be added?

The recommended concentration depends on the bonding area, adhesive volume and required support-point density.

Can SHBC customize the particle size?

Yes. Particle diameter, tolerance, supply form, solid content and packaging can be customized.

Are samples and bulk quantities available?

Yes. SHBC supports sample evaluation, pilot orders and long-term bulk supply.

Request a Sample or Quotation

Contact SHBC for PAPS600UM samples, technical specifications, custom spacer microspheres and bulk pricing.

Please provide:

  • Target application

  • Required gap thickness

  • Adhesive or carrier system

  • Required quantity

  • Preferred supply form

  • Packaging requirements

  • Estimated annual demand

Product: 600um Spacer PS Microspheres
Catalog Number: PAPS600UM
Material: Polystyrene, PS
Nominal Particle Size: 600 μm
Brand: SHBC
Manufacturer: Shanghai SanYu Biotechnology Co., Ltd.

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