
Products
SHBC provides colored microspheres, fluorescent microspheres, magnetic beads, silica microspheres, chromatography packing microspheres and biological reagents for diagnostic assay development, nucleic acid extraction, protein purification and separation applications.
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PAPS700UM
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SHBC
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700µm
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5g 10g 50g 100g 1000g
700um Spacer PS Microspheres PAPS700UM
SHBC PAPS700UM are 700 μm polystyrene microspheres developed for large-gap control, bond-line thickness control and precision component spacing.
The spherical polymer particles form physical support points between assembled surfaces. They can be evaluated in adhesives, sealants, optical assemblies, electronic modules and industrial components.
Product Specifications
Parameter | Specification |
|---|---|
Product Name | Spacer PS Microspheres |
Catalog Number | PAPS700UM |
Material | Polystyrene, PS |
Nominal Particle Size | 700 μm |
Particle Shape | Spherical |
Main Function | Large-gap and thickness control |
Brand | SHBC |
Manufacturer | Shanghai SanYu Biotechnology Co., Ltd. |
Batch-specific particle size distribution, supply form, packaging and storage information are available in the product specification and Certificate of Analysis.
Key Advantages
Controlled 700 μm Spacing
The nominal particle diameter helps maintain an approximately 700 μm separation between bonded surfaces.
Uniform Spherical Morphology
Regular spherical particles provide stable support points and help reduce local gap variation.
Controlled Particle Sizing
Consistent particle sizing supports repeatable thickness control and assembly performance.
Smooth Particle Surface
The smooth surface supports distribution in compatible adhesives, sealants, coatings and resin systems.
Large-Gap Spacer Option
PAPS700UM is suitable for applications requiring larger spacing than common small-particle spacer materials.
Custom and Bulk Supply
SHBC supports sample evaluation, customized specifications, pilot orders and bulk production.
Main Applications
Adhesive Bond-Line Control
PAPS700UM can be dispersed in compatible adhesives or sealants to help maintain an approximately 700 μm bond line.
Electronic Module Assembly
Suitable for controlling spacing between circuit boards, substrates, housings and supporting components.
Sensor and Enclosure Bonding
Can be evaluated in sensors, control units and electronic enclosures requiring controlled adhesive thickness.
Optical Component Assembly
Suitable for large-gap spacing between lenses, glass substrates, optical housings and imaging components.
Industrial Component Bonding
Used in fixtures, mechanical parts and industrial assemblies requiring repeatable separation.
Resin and Coating Thickness Control
Can serve as a physical spacer in compatible coatings, resins and composite material systems.
Prototype and Test Assemblies
Suitable for laboratory fixtures and product development projects requiring controlled large gaps.
How 700um Spacer Microspheres Work
PAPS700UM microspheres are distributed in an adhesive, coating or compatible carrier.
During assembly, the particles form support points between two surfaces. Their nominal diameter helps limit excessive compression and maintain the required separation.
Final gap thickness may also depend on:
Mean particle diameter
Maximum particle diameter
Particle size distribution
Particle concentration
Adhesive viscosity
Assembly pressure
Substrate flatness
Product Benefits
PAPS700UM helps provide:
Controlled large-gap spacing
More uniform bond-line thickness
Stable support-point distribution
Reduced local gap variation
Improved component alignment
Repeatable assembly processes
Customized particle specifications
Reliable industrial supply
Processing Recommendations
Disperse the microspheres evenly in the adhesive before dispensing or bonding.
Important processing factors include:
Adhesive compatibility
Particle loading
Adhesive viscosity
Mixing speed
Dispensing equipment
Material-path diameter
Assembly pressure
Support-point density
Use gentle mechanical mixing to minimize air and bubble formation.
The dispensing nozzle and material path must be sufficiently larger than 700 μm to reduce the risk of blockage.
Particle Loading Considerations
The appropriate particle concentration depends on the bonding area, adhesive volume and required number of support points.
Low loading may provide insufficient support. Excessive loading may affect adhesive flow, dispensing performance and bond strength.
Evaluate the following before production:
Particle dispersion
Particle settling
Adhesive flow
Dispensing stability
Final gap thickness
Bond strength
Long-term compatibility
Process validation is recommended for each adhesive and assembly system.
How to Select PAPS700UM
Consider the following factors:
Target gap thickness
Mean particle diameter
Maximum particle diameter
Particle size tolerance
Adhesive chemistry
Adhesive viscosity
Dispensing method
Assembly pressure
Operating environment
The maximum particle diameter should be evaluated when strict bond-line thickness control is required.
Custom Spacer Microspheres
SHBC can customize spacer microspheres according to project requirements.
Customization options may include:
Custom particle diameter
Particle size tolerance
Particle size distribution
Solid content
Dispersion medium
Surface treatment
Dry powder or suspension
Custom packaging
OEM and ODM supply
Please provide the target gap, adhesive system, application and required quantity when requesting customization.
Quality Control and Documents
Available product documents may include:
Certificate of Analysis
Technical Data Sheet
Safety Data Sheet
Particle size test report
Particle size distribution data
Batch inspection record
Customized specification sheet
Why Choose SHBC?
Shanghai SanYu Biotechnology Co., Ltd. supplies polymer microspheres, silica microspheres, magnetic beads and functional particle materials.
SHBC provides:
Precision particle manufacturing
Stable batch quality
Multiple particle-size options
Customized specifications
Sample evaluation support
Pilot-scale production
Bulk manufacturing capability
OEM and ODM services
Frequently Asked Questions
What are PAPS700UM microspheres?
PAPS700UM are nominal 700 μm polystyrene microspheres designed for large-gap and bond-line thickness control.
What applications are suitable for PAPS700UM?
They can be evaluated for adhesive bonding, electronic modules, optical components, sensors, enclosures and industrial assemblies.
Can PAPS700UM create an exact 700 μm gap?
The nominal particle diameter helps control the gap. Final thickness also depends on the maximum particle diameter, particle distribution, adhesive properties and assembly pressure.
Can PAPS700UM be added to epoxy adhesives?
Yes. They can be evaluated in compatible epoxy, UV-curable adhesive, silicone, sealant and other polymer systems.
Can the particles pass through dispensing equipment?
The nozzle and material path must be larger than the particle diameter. Equipment compatibility should be confirmed before use.
How much PAPS700UM should be added?
The recommended concentration depends on the bonding area, adhesive volume and required support-point density.
Will the particles affect adhesive performance?
Particle loading and dispersion may influence adhesive flow, dispensing and bond strength. Compatibility testing is recommended.
Can SHBC customize the particle size?
Yes. Particle diameter, tolerance, supply form, dispersion medium and packaging can be customized.
Are samples and bulk quantities available?
Yes. SHBC supports sample evaluation, pilot orders and long-term bulk supply.
Request a Sample or Quotation
Contact SHBC for PAPS700UM samples, technical specifications, customized spacer microspheres and bulk pricing.
Please provide:
Target application
Required gap thickness
Adhesive or carrier system
Required quantity
Preferred supply form
Packaging requirements
Estimated annual demand
Product: 700um Spacer PS Microspheres
Catalog Number: PAPS700UM
Material: Polystyrene, PS
Nominal Particle Size: 700 μm
Brand: SHBC
Manufacturer: Shanghai SanYu Biotechnology Co., Ltd.


