70um Spacer PS Microspheres PAPS70UM 10%

70um Spacer PS Microspheres PAPS70UM

SHBC PAPS70UM are precision 70 μm polystyrene microspheres developed for bond-line thickness control, component spacing and uniform gap formation.

The spherical polymer particles form physical support points between bonded surfaces. They are suitable for adhesives, optical components, sensors, electronic packaging and precision assembly.

Product Specifications

Particle size distribution, solid content, supply form, packaging and storage conditions are available in the product specification and batch Certificate of Analysis.

Key Advantages

Controlled 70 μm Spacing

The nominal particle diameter helps create a defined gap between substrates, components and bonded surfaces.

Uniform Spherical Morphology

Regular spherical particles provide stable support points and help reduce local bond-line variation.

Controlled Particle Size Distribution

Consistent particle sizing supports repeatable thickness control and more uniform assembly results.

Smooth Particle Surface

The smooth surface supports dispersion in compatible adhesives, sealants, coatings and polymer systems.

Lightweight Polymer Spacer

The polystyrene structure offers a lower-density alternative to many inorganic spacer materials.

Reliable Industrial Supply

SHBC supports sample evaluation, pilot-scale orders, customized specifications and bulk production.

Main Applications

Adhesive Bond-Line Control

PAPS70UM can be added to compatible adhesives and sealants to help maintain an approximately 70 μm bonding gap.

Optical Component Assembly

Used to control spacing between lenses, filters, glass substrates, optical films and precision optical components.

Camera Module Assembly

Can be evaluated for controlling adhesive thickness and component separation in camera and imaging modules.

Sensor Manufacturing

Suitable for sensor structures requiring controlled adhesive thickness and uniform component spacing.

Electronic Packaging

Used for spacing between circuit boards, substrates, connectors, housings and electronic components.

Semiconductor Assembly

Can be evaluated for controlling the distance between chips, substrates and packaging materials.

Smart Glass and Display Structures

Suitable for glass and film assemblies requiring defined separation between functional layers.

How 70um Spacer Microspheres Work

PAPS70UM microspheres are dispersed in an adhesive, coating or compatible carrier.

During assembly, the particles form physical support points between two surfaces. Their nominal diameter limits excessive compression and helps control the final gap.

The actual bond-line thickness may also depend on:

• Particle size distribution

• Maximum particle diameter

• Microsphere concentration

• Adhesive viscosity

• Assembly pressure

• Substrate flatness

Benefits for Manufacturers

PAPS70UM helps provide:

• Controlled 70 μm spacing

• More uniform adhesive thickness

• Consistent support-point distribution

• Reduced local gap variation

• Improved component alignment

• Repeatable bonding processes

• Custom specification options

• Scalable bulk supply

Adhesive Processing Guide

Disperse the microspheres evenly in the adhesive before dispensing, coating or bonding.

Important processing factors include:

• Adhesive compatibility

• Microsphere loading

• Adhesive viscosity

• Mixing speed

• Dispensing equipment

• Bonding area

• Assembly pressure

• Required support-point density

Gentle mechanical mixing is recommended to reduce air introduction. Avoid excessive mixing that may create bubbles or affect the adhesive formulation.

Particle Loading Considerations

The recommended microsphere concentration depends on the bonding area, adhesive volume and required number of support points.

Insufficient loading may not provide enough support across the bonded area. Excessive loading may affect adhesive flow, dispensing performance and final bond strength.

Customers should evaluate:

• Dispersion uniformity

• Particle settling

• Adhesive flow

• Dispensing stability

• Final bond-line thickness

• Bond strength

• Long-term compatibility

Process validation is recommended before production use.

How to Select 70um Spacer Microspheres

Consider the following factors when selecting PAPS70UM:

• Target bond-line thickness

• Mean particle diameter

• Maximum particle diameter

• Particle size tolerance

• Adhesive chemistry

• Adhesive viscosity

• Dispensing method

• Assembly pressure

• Operating temperature

A controlled particle size distribution is recommended when precise and repeatable gap control is required.

Custom Spacer Microspheres

SHBC can customize spacer microspheres according to specific project requirements.

Available options may include:

• Custom particle diameter

• Particle size tolerance

• Particle size distribution

• Solid content

• Dispersion medium

• Surface treatment

• Dry powder or suspension

• Custom packaging

• OEM and ODM supply

Please provide the target gap, adhesive system, application and required quantity when requesting customization.

Quality Control and Documents

SHBC applies controlled manufacturing and batch inspection to support consistent product performance.

Available documents may include:

• Certificate of Analysis

• Technical Data Sheet

• Safety Data Sheet

• Particle size test report

• Particle size distribution data

• Batch inspection record

• Customized specification sheet

Why Choose SHBC?

Shanghai SanYu Biotechnology Co., Ltd. manufactures polymer microspheres, silica microspheres, magnetic beads and functional microsphere materials.

SHBC provides:

• Precision particle manufacturing

• Stable batch-to-batch quality

• Multiple particle-size options

• Customized product specifications

• Sample evaluation support

• Pilot-scale production

• Bulk manufacturing capability

• OEM and ODM services

Frequently Asked Questions

What are PAPS70UM microspheres?

PAPS70UM are nominal 70 μm polystyrene microspheres designed for precision spacing and bond-line thickness control.

What are 70um spacer microspheres used for?

They can be evaluated for adhesive bonding, optical components, camera modules, sensors, electronic packaging and semiconductor assembly.

Can PAPS70UM create an exact 70 μm gap?

The nominal particle diameter helps control the gap. Final thickness also depends on particle size distribution, adhesive properties, particle loading and assembly pressure.

Can PAPS70UM be mixed into epoxy adhesives?

Yes. PAPS70UM can be evaluated in compatible epoxy, UV-curable adhesive, silicone, sealant and other polymer systems.

How much PAPS70UM should be added?

The recommended concentration depends on the bonding area, adhesive volume, viscosity, dispensing method and required support-point density.

Will the particles affect adhesive performance?

Particle loading and dispersion may influence adhesive flow, dispensing and bond strength. Compatibility testing is recommended.

Can SHBC customize the particle specifications?

Yes. Particle size, tolerance, solid content, dispersion medium, supply form and packaging can be customized.

Are samples and bulk quantities available?

Yes. SHBC supports laboratory samples, pilot-scale orders and long-term bulk supply.

Request a Sample or Quotation

Contact SHBC for PAPS70UM samples, technical specifications, customized spacer microspheres and bulk pricing.

Please provide:

• Target application

• Required gap thickness

• Adhesive or carrier system

• Required quantity

• Preferred supply form

• Packaging requirements

• Estimated annual demand

Product: 70um Spacer PS Microspheres
Catalog Number: PAPS70UM
Material: Polystyrene, PS
Nominal Particle Size: 70 μm
Brand: SHBC
Manufacturer: Shanghai SanYu Biotechnology Co., Ltd.