80um Spacer PS Microspheres PAPS80UM 10%

80um Spacer PS Microspheres PAPS80UM

SHBC PAPS80UM are precision 80 μm polystyrene microspheres developed for bond-line thickness control, component spacing and uniform gap formation.

The spherical polymer particles form physical support points between bonded surfaces. They are suitable for adhesives, optical components, camera modules, sensors, electronic packaging and precision assembly.

Product Specifications

Batch-specific particle size distribution, solid content, supply form, packaging and storage conditions are available in the product specification and Certificate of Analysis.

Key Advantages

Controlled 80 μm Spacing

The nominal particle diameter helps maintain a defined gap between substrates, components and bonded surfaces.

Uniform Spherical Morphology

Regular spherical particles provide stable support points and help reduce local bond-line variation.

Controlled Particle Distribution

Consistent particle sizing supports repeatable thickness control and assembly performance.

Smooth Particle Surface

The smooth surface supports dispersion in compatible adhesives, sealants, coatings and polymer systems.

Lightweight Polymer Structure

Polystyrene provides a lower-density spacer option compared with many inorganic particles, helping reduce settling in suitable formulations.

Scalable Supply

SHBC supports samples, pilot-scale orders, customized specifications and bulk production.

Main Applications

Adhesive Bond-Line Control

PAPS80UM can be added to compatible adhesives or sealants to help maintain an approximately 80 μm bond line.

Camera Module Assembly

Used to control adhesive thickness and component spacing in camera, imaging and optical modules.

Optical Component Bonding

Suitable for spacing between lenses, filters, glass substrates, optical films and other precision components.

Sensor Manufacturing

Can be evaluated in pressure, optical and electronic sensors requiring uniform adhesive thickness.

Semiconductor Packaging

Used for controlling spacing between chips, substrates and packaging components.

Electronic Component Assembly

Suitable for circuit boards, housings, connectors and components requiring a defined assembly gap.

Flexible Electronic Devices

Can be evaluated for controlling electrode or functional-layer spacing in flexible electronic structures.

How 80um Spacer Microspheres Work

PAPS80UM microspheres are mixed into an adhesive, coating or compatible carrier.

During assembly, the particles form physical support points between two surfaces. Their nominal diameter limits excessive compression and helps control the final separation distance.

The actual gap may also be affected by:

• Particle size distribution

• Maximum particle diameter

• Particle concentration

• Adhesive viscosity

• Assembly pressure

• Substrate flatness

Product Benefits

PAPS80UM helps provide:

• Controlled 80 μm spacing

• Uniform adhesive thickness

• Consistent support-point distribution

• Reduced local gap variation

• Improved component alignment

• Repeatable bonding processes

• Custom specification options

• Reliable bulk supply

Adhesive Processing Guide

Disperse the microspheres evenly in the adhesive before dispensing, coating or bonding.

Important processing factors include:

• Adhesive compatibility

• Microsphere concentration

• Adhesive viscosity

• Mixing speed

• Dispensing equipment

• Bonding area

• Assembly pressure

• Required support-point density

Gentle mechanical mixing is recommended to minimize air introduction. Avoid excessive mixing that may create bubbles or affect adhesive performance.

Particle Loading Considerations

The required microsphere concentration depends on the bonding area, adhesive volume and number of support points needed.

Insufficient loading may result in uneven gap control. Excessive loading may affect adhesive flow, dispensing and bond strength.

Customers should evaluate:

• Dispersion uniformity

• Particle settling

• Dispensing stability

• Final bond-line thickness

• Bond strength

• Long-term compatibility

Process validation is recommended before production use.

How to Select 80um Spacer Microspheres

Consider the following factors:

• Target bond-line thickness

• Mean particle diameter

• Maximum particle diameter

• Particle size tolerance

• Adhesive chemistry

• Adhesive viscosity

• Dispensing method

• Assembly pressure

• Operating conditions

A controlled particle size distribution is recommended for precise and repeatable gap control.

Custom Spacer Microspheres

SHBC can customize spacer microspheres according to project requirements.

Available options may include:

• Custom particle diameter

• Particle size tolerance

• Particle size distribution

• Solid content

• Dispersion medium

• Surface treatment

• Dry powder or suspension

• Custom packaging

• OEM and ODM supply

Please provide the target gap, adhesive system, application and required quantity when requesting customization.

Quality Control and Documents

SHBC applies controlled manufacturing and batch inspection to support consistent product performance.

Available documents may include:

• Certificate of Analysis

• Technical Data Sheet

• Safety Data Sheet

• Particle size test report

• Particle size distribution data

• Batch inspection record

• Customized specification sheet

Why Choose SHBC?

Shanghai SanYu Biotechnology Co., Ltd. manufactures polymer microspheres, silica microspheres, magnetic beads and functional microsphere materials.

SHBC provides:

• Precision particle manufacturing

• Stable batch-to-batch quality

• Multiple particle-size options

• Customized specifications

• Sample evaluation support

• Pilot-scale production

• Bulk manufacturing capability

• OEM and ODM services

Frequently Asked Questions

What are PAPS80UM microspheres?

PAPS80UM are nominal 80 μm polystyrene microspheres designed for precision gap and bond-line thickness control.

What are 80um spacer microspheres used for?

They can be evaluated for adhesive bonding, camera modules, optical components, sensors, electronic packaging and semiconductor assembly.

Can PAPS80UM create an exact 80 μm gap?

The nominal particle diameter helps control the gap. Final thickness also depends on particle distribution, adhesive properties, loading and assembly pressure.

Can PAPS80UM be mixed into epoxy adhesives?

Yes. PAPS80UM can be evaluated in compatible epoxy, UV-curable adhesive, silicone, sealant and other polymer systems.

How much PAPS80UM should be added?

The recommended concentration depends on the bonding area, adhesive volume, viscosity, dispensing method and required support-point density.

Will PAPS80UM affect adhesive performance?

Particle concentration and dispersion may affect adhesive flow, dispensing and bond strength. Compatibility testing is recommended.

Can SHBC customize the specifications?

Yes. Particle size, tolerance, solid content, dispersion medium, supply form and packaging can be customized.

Are samples and bulk quantities available?

Yes. SHBC supports laboratory samples, pilot-scale orders and long-term bulk supply.

Request a Sample or Quotation

Contact SHBC for PAPS80UM samples, technical specifications, customized spacer microspheres and bulk pricing.

Please provide:

• Target application

• Required gap thickness

• Adhesive or carrier system

• Required quantity

• Preferred supply form

• Packaging requirements

• Estimated annual demand

Product: 80um Spacer PS Microspheres
Catalog Number: PAPS80UM
Material: Polystyrene, PS
Nominal Particle Size: 80 μm
Brand: SHBC
Manufacturer: Shanghai SanYu Biotechnology Co., Ltd.