90um Spacer PS Microspheres PAPS90UM 10%

90um Spacer PS Microspheres PAPS90UM

SHBC PAPS90UM are precision 90 μm polystyrene microspheres developed for bond-line thickness control, component spacing and uniform gap formation.

The spherical polymer particles form physical support points between bonded surfaces. They can be evaluated for adhesives, optical components, camera modules, sensors, semiconductor packaging and electronic assembly.

Product Specifications

Batch-specific particle size distribution, solid content, supply form, packaging and storage conditions are provided in the product specification or Certificate of Analysis.

Key Advantages

Controlled 90 μm Spacing

The nominal particle diameter helps maintain a defined gap between substrates, components and bonded surfaces.

Uniform Spherical Morphology

Regular spherical particles provide consistent support points and help reduce local bond-line variation.

Controlled Particle Size Distribution

Consistent particle sizing supports repeatable thickness control and stable assembly results.

Smooth Particle Surface

The smooth surface supports dispersion in compatible adhesives, sealants, coatings and polymer systems.

Lightweight Polymer Spacer

The polystyrene structure provides a lightweight alternative to many inorganic spacer materials.

Scalable Manufacturing

SHBC supports sample evaluation, pilot-scale orders, customized specifications and bulk production.

Main Applications

Adhesive Bond-Line Control

PAPS90UM can be mixed into compatible adhesives or sealants to help maintain an approximately 90 μm bonding gap.

Optical Component Assembly

Suitable for controlling spacing between lenses, optical filters, glass substrates, films and precision optical components.

Camera Module Assembly

Can be evaluated for controlling adhesive thickness and component separation in camera and imaging modules.

Sensor Manufacturing

Suitable for pressure sensors, optical sensors and electronic sensor assemblies requiring uniform adhesive thickness.

Semiconductor Packaging

Used for evaluating gap control between chips, substrates and packaging components.

Electronic Component Assembly

Suitable for circuit boards, housings, connectors and electronic components requiring defined separation.

Smart Glass and Functional Films

Can be evaluated in glass and film assemblies requiring controlled spacing between functional layers.

How 90um Spacer Microspheres Work

PAPS90UM microspheres are dispersed in an adhesive, coating or compatible carrier.

During assembly, the particles form physical support points between two surfaces. Their nominal diameter limits excessive compression and helps control the final gap.

The final bond-line thickness may also depend on:

• Particle size distribution

• Maximum particle diameter

• Microsphere concentration

• Adhesive viscosity

• Assembly pressure

• Substrate flatness

Product Benefits

PAPS90UM helps support:

• Controlled 90 μm spacing

• More uniform adhesive thickness

• Consistent support-point distribution

• Reduced local gap variation

• Improved component alignment

• Repeatable bonding processes

• Customized product development

• Reliable bulk supply

Adhesive Processing Guide

Disperse the microspheres evenly in the adhesive before dispensing, coating or bonding.

Important processing factors include:

• Adhesive compatibility

• Particle concentration

• Adhesive viscosity

• Mixing speed

• Dispensing equipment

• Bonding area

• Assembly pressure

• Required support-point density

Gentle mechanical mixing is recommended to minimize air introduction. Avoid excessive mixing that may create bubbles or affect adhesive performance.

Particle Loading Considerations

The recommended particle loading depends on the bonding area, adhesive volume and required number of support points.

Insufficient loading may result in uneven gap control. Excessive loading may affect adhesive flow, dispensing stability and bond strength.

Customers should evaluate:

• Dispersion uniformity

• Particle settling

• Adhesive flow

• Dispensing performance

• Final bond-line thickness

• Bond strength

• Long-term material compatibility

Process validation is recommended before production use.

How to Select 90um Spacer Microspheres

Consider the following factors when selecting PAPS90UM:

• Target bond-line thickness

• Mean particle diameter

• Maximum particle diameter

• Particle size tolerance

• Adhesive chemistry

• Adhesive viscosity

• Dispensing method

• Assembly pressure

• Operating temperature

A controlled particle size distribution is recommended for precise and repeatable gap control.

Custom Spacer Microspheres

SHBC can customize spacer microspheres according to specific project requirements.

Available options may include:

• Custom particle diameter

• Particle size tolerance

• Particle size distribution

• Solid content

• Dispersion medium

• Surface treatment

• Dry powder or suspension

• Custom packaging

• OEM and ODM supply

Please provide the target gap, adhesive system, application and required quantity when requesting customization.

Quality Control and Documents

SHBC applies controlled manufacturing and batch inspection to support consistent product quality.

Available documents may include:

• Certificate of Analysis

• Technical Data Sheet

• Safety Data Sheet

• Particle size test report

• Particle size distribution data

• Batch inspection record

• Customized specification sheet

Why Choose SHBC?

Shanghai SanYu Biotechnology Co., Ltd. manufactures polymer microspheres, silica microspheres, magnetic beads and functional microsphere materials.

SHBC provides:

• Precision particle manufacturing

• Stable batch-to-batch quality

• Multiple particle-size options

• Customized specifications

• Sample evaluation support

• Pilot-scale production

• Bulk manufacturing capability

• OEM and ODM services

Frequently Asked Questions

What are PAPS90UM microspheres?

PAPS90UM are nominal 90 μm polystyrene microspheres designed for precision gap and bond-line thickness control.

What are 90um spacer microspheres used for?

They can be evaluated for adhesive bonding, optical components, camera modules, sensors, semiconductor packaging and electronic assembly.

Can PAPS90UM create an exact 90 μm gap?

The nominal particle diameter helps control the gap. Final thickness also depends on particle size distribution, loading, adhesive properties and assembly pressure.

Can PAPS90UM be mixed into epoxy adhesives?

Yes. PAPS90UM can be evaluated in compatible epoxy, UV-curable adhesive, silicone, sealant and other polymer systems.

How much PAPS90UM should be added?

The recommended concentration depends on the bonding area, adhesive volume, viscosity, dispensing method and required support-point density.

Will the microspheres affect adhesive performance?

Particle concentration and dispersion may influence adhesive flow, dispensing and bond strength. Compatibility testing is recommended.

Can SHBC customize the particle specifications?

Yes. Particle diameter, size tolerance, solid content, dispersion medium, supply form and packaging can be customized.

Are samples available?

Samples are available for dispersion, compatibility and bonding-process evaluation.

Does SHBC support bulk production?

Yes. SHBC supports laboratory samples, pilot-scale orders and long-term bulk supply.

Request a Sample or Quotation

Contact SHBC for PAPS90UM samples, technical specifications, customized spacer microspheres and bulk pricing.

Please provide:

• Target application

• Required gap thickness

• Adhesive or carrier system

• Required quantity

• Preferred supply form

• Packaging requirements

• Estimated annual demand

Product: 90um Spacer PS Microspheres
Catalog Number: PAPS90UM
Material: Polystyrene, PS
Nominal Particle Size: 90 μm
Brand: SHBC
Manufacturer: Shanghai SanYu Biotechnology Co., Ltd.