200um Spacer PS Microspheres PAPS200UM 10%

200um Spacer PS Microspheres PAPS200UM

SHBC PAPS200UM are precision 200 μm polystyrene microspheres developed for bond-line thickness control, component spacing and uniform gap formation.

The spherical polymer particles provide physical support between bonded surfaces. They are suitable for adhesives, optical components, camera modules, sensors, electronic packaging and precision assembly.

Product Specifications

Batch-specific particle size distribution, solid content, supply form, packaging and storage conditions are available in the product specification and Certificate of Analysis.

Key Advantages

Controlled 200 μm Spacing

The nominal particle diameter helps maintain a defined gap between substrates, components and bonded surfaces.

Uniform Spherical Morphology

Regular spherical particles provide stable support points and help reduce local bond-line variation.

Controlled Particle Size Distribution

Consistent particle sizing supports repeatable thickness control and assembly performance.

Smooth Particle Surface

The smooth surface supports uniform distribution in compatible adhesives, sealants, coatings and polymer systems.

Lightweight Polymer Spacer

The polystyrene structure provides a lower-density alternative to many inorganic spacer materials.

Scalable Industrial Supply

SHBC supports laboratory samples, pilot orders, customized specifications and bulk production.

Main Applications

Adhesive Bond-Line Control

PAPS200UM can be mixed into compatible adhesives or sealants to help maintain an approximately 200 μm bonding gap.

Camera Module Assembly

Used to control adhesive thickness and component spacing in camera, imaging and optical modules.

Optical Component Bonding

Suitable for spacing between lenses, filters, glass substrates, optical films and precision optical components.

Sensor Manufacturing

Can be evaluated in optical, pressure and electronic sensors requiring controlled adhesive thickness.

Semiconductor Packaging

Suitable for controlling spacing between chips, substrates and packaging components.

Electronic Component Assembly

Used in circuit boards, housings, connectors and electronic components requiring a defined assembly gap.

Smart Glass and Functional Films

Can be evaluated in glass and film structures requiring controlled separation between functional layers.

How 200um Spacer Microspheres Work

PAPS200UM microspheres are dispersed in an adhesive, coating or compatible carrier.

During assembly, the particles form physical support points between two surfaces. Their nominal diameter limits excessive compression and helps control the final separation distance.

The actual bond-line thickness may also depend on:

• Particle size distribution

• Maximum particle diameter

• Microsphere loading

• Adhesive viscosity

• Assembly pressure

• Substrate flatness

Product Benefits

PAPS200UM helps provide:

• Controlled 200 μm spacing

• More uniform bond-line thickness

• Consistent support-point distribution

• Reduced local gap variation

• Improved component alignment

• Repeatable bonding processes

• Customized particle specifications

• Reliable bulk supply

Adhesive Processing Guide

Disperse the microspheres evenly in the adhesive before dispensing, coating or bonding.

Important processing factors include:

• Adhesive compatibility

• Microsphere concentration

• Adhesive viscosity

• Mixing speed

• Dispensing equipment

• Bonding area

• Assembly pressure

• Required support-point density

Gentle mechanical mixing is recommended to minimize air introduction. Avoid excessive mixing that may create bubbles or affect adhesive performance.

Particle Loading Considerations

The recommended particle concentration depends on the bonding area, adhesive volume and required number of support points.

Insufficient loading may result in uneven gap control. Excessive loading may affect adhesive flow, dispensing stability and bond strength.

Customers should evaluate:

• Dispersion uniformity

• Particle settling

• Adhesive flow

• Dispensing performance

• Final bond-line thickness

• Bond strength

• Long-term compatibility

Process validation is recommended before production use.

How to Select PAPS200UM

Consider the following factors when selecting spacer microspheres:

• Target bond-line thickness

• Mean particle diameter

• Maximum particle diameter

• Particle size tolerance

• Adhesive chemistry

• Adhesive viscosity

• Dispensing method

• Assembly pressure

• Operating conditions

A controlled particle size distribution is recommended when precise and repeatable gap control is required.

Custom Spacer Microspheres

SHBC can customize spacer microspheres according to specific project requirements.

Available options may include:

• Custom particle diameter

• Particle size tolerance

• Particle size distribution

• Solid content

• Dispersion medium

• Surface treatment

• Dry powder or suspension

• Custom packaging

• OEM and ODM supply

Please provide the target gap, adhesive system, application and required quantity when requesting customization.

Quality Control and Documents

SHBC applies controlled manufacturing and batch inspection to support consistent product quality.

Available documents may include:

• Certificate of Analysis

• Technical Data Sheet

• Safety Data Sheet

• Particle size test report

• Particle size distribution data

• Batch inspection record

• Customized specification sheet

Why Choose SHBC?

Shanghai SanYu Biotechnology Co., Ltd. supplies polymer microspheres, silica microspheres, magnetic beads and functional microsphere materials.

SHBC provides:

• Precision particle manufacturing

• Stable batch-to-batch quality

• Multiple particle-size options

• Customized specifications

• Sample evaluation support

• Pilot-scale production

• Bulk manufacturing capability

• OEM and ODM services

Frequently Asked Questions

What are PAPS200UM microspheres?

PAPS200UM are nominal 200 μm polystyrene microspheres designed for precision gap and bond-line thickness control.

What are 200um spacer microspheres used for?

They can be evaluated for adhesive bonding, camera modules, optical components, sensors, semiconductor packaging and electronic assembly.

Can PAPS200UM create an exact 200 μm gap?

The nominal diameter helps control the gap. Final thickness also depends on particle size distribution, loading, adhesive properties and assembly pressure.

Can PAPS200UM be mixed into epoxy adhesives?

Yes. PAPS200UM can be evaluated in compatible epoxy, UV-curable adhesive, silicone, sealant and other polymer systems.

How much PAPS200UM should be added?

The recommended concentration depends on the bonding area, adhesive volume, viscosity, dispensing method and required support-point density.

Will the microspheres affect adhesive performance?

Particle loading and dispersion may affect adhesive flow, dispensing and bond strength. Compatibility testing is recommended.

Can SHBC customize the specifications?

Yes. Particle diameter, size tolerance, solid content, dispersion medium, supply form and packaging can be customized.

Are samples and bulk quantities available?

Yes. SHBC supports laboratory samples, pilot-scale orders and long-term bulk supply.

Request a Sample or Quotation

Contact SHBC for PAPS200UM samples, technical specifications, customized spacer microspheres and bulk pricing.

Please provide:

• Target application

• Required gap thickness

• Adhesive or carrier system

• Required quantity

• Preferred supply form

• Packaging requirements

• Estimated annual demand

Product: 200um Spacer PS Microspheres
Catalog Number: PAPS200UM
Material: Polystyrene, PS
Nominal Particle Size: 200 μm
Brand: SHBC
Manufacturer: Shanghai SanYu Biotechnology Co., Ltd.