400um Spacer PS Microspheres PAPS400UM 10%

400um Spacer PS Microspheres PAPS400UM

SHBC PAPS400UM are precision 400 μm polystyrene microspheres designed for large-gap control, bond-line thickness control and component spacing.

The uniform spherical particles form physical support points between bonded surfaces. They can be evaluated for adhesives, optical assemblies, sensors, electronic modules and precision industrial components.

Product Specifications

Actual particle size distribution, solid content, supply form, packaging and storage conditions are provided in the product specification and batch Certificate of Analysis.

Key Advantages

Controlled 400 μm Spacing

The nominal particle diameter helps create a defined separation between substrates, components and bonded surfaces.

Uniform Spherical Morphology

Regular spherical particles provide stable support points and help reduce local thickness variation.

Controlled Particle Size Distribution

Consistent particle sizing supports repeatable gap control and assembly performance.

Smooth Particle Surface

The smooth surface supports distribution in compatible adhesives, sealants, coatings and polymer systems.

Lightweight Polymer Structure

Polystyrene offers a lower-density spacer option compared with many glass or inorganic particles.

Scalable Industrial Supply

SHBC supports sample evaluation, pilot orders, customized specifications and bulk production.

Main Applications

Adhesive Bond-Line Control

PAPS400UM can be mixed into compatible adhesives or sealants to help maintain an approximately 400 μm bond line.

Optical Component Assembly

Suitable for spacing between lenses, optical filters, glass substrates, housings and other precision components.

Sensor and Enclosure Assembly

Can be evaluated in sensor housings and electronic enclosures requiring controlled adhesive thickness.

Electronic Module Packaging

Used for maintaining defined spacing between circuit boards, substrates, housings and supporting components.

Camera and Imaging Modules

Suitable for controlling component separation and adhesive thickness in large-gap optical assemblies.

Industrial Component Bonding

Can be evaluated in fixtures, mechanical components and prototype assemblies requiring repeatable spacing.

Coating and Resin Thickness Control

Used as a physical spacer in compatible coating, resin and composite material systems.

How 400um Spacer Microspheres Work

PAPS400UM microspheres are distributed in an adhesive, coating or compatible carrier.

During assembly, the particles form physical support points between two surfaces. Their nominal diameter helps limit compression and control the final separation distance.

The actual gap may also be affected by:

• Mean particle diameter

• Maximum particle diameter

• Particle size distribution

• Microsphere concentration

• Adhesive viscosity

• Assembly pressure

• Substrate flatness

Product Benefits

PAPS400UM helps provide:

• Controlled 400 μm spacing

• More uniform bond-line thickness

• Consistent support-point distribution

• Reduced local gap variation

• Improved component alignment

• Repeatable bonding processes

• Customized particle specifications

• Reliable bulk supply

Adhesive Processing Guide

Disperse the microspheres evenly in the adhesive before dispensing, coating or bonding.

Important processing factors include:

• Adhesive compatibility

• Particle loading

• Adhesive viscosity

• Mixing speed

• Dispensing equipment

• Bonding area

• Assembly pressure

• Required support-point density

Gentle mechanical mixing is recommended to minimize air introduction. Avoid excessive mixing that may create bubbles or damage the microspheres.

Particle Loading Considerations

The recommended concentration depends on the bonding area, adhesive volume and required number of support points.

Insufficient loading may produce uneven gap control. Excessive loading may affect adhesive flow, dispensing performance and bond strength.

Customers should evaluate:

• Particle dispersion

• Particle settling

• Adhesive flow

• Dispensing stability

• Final bond-line thickness

• Bond strength

• Long-term compatibility

Process validation is recommended before production use.

How to Select PAPS400UM

Consider the following factors when selecting 400um spacer microspheres:

• Target gap thickness

• Mean particle diameter

• Maximum particle diameter

• Particle size tolerance

• Adhesive chemistry

• Adhesive viscosity

• Dispensing method

• Assembly pressure

• Operating temperature

A controlled particle size distribution is recommended for precise and repeatable spacing.

Custom Spacer Microspheres

SHBC can customize spacer microspheres according to project requirements.

Available options may include:

• Custom particle diameter

• Particle size tolerance

• Particle size distribution

• Solid content

• Dispersion medium

• Surface treatment

• Dry powder or suspension

• Custom packaging

• OEM and ODM supply

Please provide the target gap, adhesive system, application and required quantity when requesting customization.

Quality Control and Documents

Available product documents may include:

• Certificate of Analysis

• Technical Data Sheet

• Safety Data Sheet

• Particle size test report

• Particle size distribution data

• Batch inspection record

• Customized specification sheet

Why Choose SHBC?

Shanghai SanYu Biotechnology Co., Ltd. supplies polymer microspheres, silica microspheres, magnetic beads and functional microsphere materials.

SHBC provides:

• Precision particle manufacturing

• Stable batch-to-batch quality

• Multiple particle-size options

• Customized specifications

• Sample evaluation support

• Pilot-scale production

• Bulk manufacturing capability

• OEM and ODM services

Frequently Asked Questions

What are PAPS400UM microspheres?

PAPS400UM are nominal 400 μm polystyrene microspheres designed for large-gap and bond-line thickness control.

What are 400um spacer microspheres used for?

They can be evaluated for adhesive bonding, optical assemblies, sensors, electronic modules, enclosures and industrial components.

Can PAPS400UM create an exact 400 μm gap?

The nominal particle diameter helps control the gap. Final thickness also depends on particle size distribution, loading, adhesive properties and assembly pressure.

Can PAPS400UM be mixed into epoxy adhesives?

Yes. They can be evaluated in compatible epoxy, UV-curable adhesive, silicone, sealant and other polymer systems.

How much PAPS400UM should be added?

The recommended concentration depends on the bonding area, adhesive volume, viscosity and required support-point density.

Will the particles affect adhesive performance?

Particle loading and dispersion may influence adhesive flow, dispensing and bond strength. Compatibility testing is recommended.

Can SHBC customize the particle specifications?

Yes. Particle diameter, size tolerance, solid content, supply form and packaging can be customized.

Are samples and bulk quantities available?

Yes. SHBC supports laboratory samples, pilot orders and long-term bulk supply.

Request a Sample or Quotation

Contact SHBC for PAPS400UM samples, technical specifications, customized spacer microspheres and bulk pricing.

Please provide:

• Target application

• Required gap thickness

• Adhesive or carrier system

• Required quantity

• Preferred supply form

• Packaging requirements

• Estimated annual demand

Product: 400um Spacer PS Microspheres
Catalog Number: PAPS400UM
Material: Polystyrene, PS
Nominal Particle Size: 400 μm
Brand: SHBC
Manufacturer: Shanghai SanYu Biotechnology Co., Ltd.