500um Spacer PS Microspheres PAPS500UM 10%

500um Spacer PS Microspheres PAPS500UM

SHBC PAPS500UM are precision 500 μm polystyrene microspheres developed for large-gap control, bond-line thickness control and component spacing.

The spherical polymer particles form physical support points between bonded surfaces. They are suitable for adhesives, optical components, sensors, electronic modules and precision industrial assembly.

Product Specifications

Batch-specific particle size distribution, solid content, supply form, packaging and storage conditions are provided in the product specification and Certificate of Analysis.

Key Advantages

Controlled 500 μm Spacing

The nominal particle diameter helps maintain an approximately 500 μm separation between bonded surfaces and assembled components.

Uniform Spherical Morphology

Regular spherical particles provide stable support points and help reduce local gap variation.

Controlled Particle Size Distribution

Consistent particle sizing supports repeatable thickness control and assembly performance.

Smooth Particle Surface

The smooth surface supports distribution in compatible adhesives, sealants, coatings and polymer systems.

Lightweight Polymer Material

The polystyrene structure provides a lightweight spacer option for large-gap industrial applications.

Scalable Manufacturing

SHBC supports samples, pilot orders, customized specifications and long-term bulk supply.

Main Applications

Adhesive Bond-Line Control

PAPS500UM can be mixed into compatible adhesives and sealants to help maintain an approximately 500 μm bond line.

Optical Component Assembly

Suitable for spacing between lenses, filters, glass substrates, optical housings and other precision components.

Sensor and Enclosure Assembly

Can be evaluated in sensor housings and electronic enclosures requiring controlled adhesive thickness.

Electronic Module Packaging

Used to maintain defined spacing between circuit boards, substrates, housings and supporting components.

Camera and Imaging Modules

Suitable for controlling component separation in optical and imaging assemblies with larger gap requirements.

Industrial Component Bonding

Can be evaluated in fixtures, mechanical components and industrial assemblies requiring repeatable spacing.

Coating and Resin Thickness Control

Used as a physical spacer in compatible resin, coating and composite material systems.

How 500um Spacer Microspheres Work

PAPS500UM microspheres are distributed in an adhesive, coating or compatible carrier.

During assembly, the particles form physical support points between two surfaces. Their nominal diameter helps limit excessive compression and control the final separation distance.

The actual bond-line thickness may also depend on:

• Mean particle diameter

• Maximum particle diameter

• Particle size distribution

• Particle concentration

• Adhesive viscosity

• Assembly pressure

• Substrate flatness

Product Benefits

PAPS500UM helps provide:

• Controlled 500 μm spacing

• More uniform bond-line thickness

• Consistent support-point distribution

• Reduced local gap variation

• Improved component alignment

• Repeatable assembly processes

• Custom particle specifications

• Reliable industrial supply

Processing Recommendations

Disperse the microspheres evenly in the adhesive before dispensing, coating or bonding.

Important processing factors include:

• Adhesive compatibility

• Particle loading

• Adhesive viscosity

• Mixing speed

• Dispensing equipment

• Nozzle or dispensing-path diameter

• Assembly pressure

• Required support-point density

Use gentle mechanical mixing to minimize air introduction and particle damage.

The dispensing nozzle and material path must be sufficiently larger than the microsphere diameter to reduce the risk of blockage.

Particle Loading Considerations

The recommended concentration depends on the bonding area, adhesive volume and required number of support points.

Insufficient loading may result in uneven gap control. Excessive loading may affect adhesive flow, dispensing performance and bond strength.

Evaluate the following factors before production:

• Particle dispersion

• Particle settling

• Adhesive flow

• Dispensing stability

• Final bond-line thickness

• Bond strength

• Long-term compatibility

Process validation is recommended for each adhesive and assembly system.

How to Select PAPS500UM

Consider the following factors when selecting 500um spacer microspheres:

• Target gap thickness

• Mean particle diameter

• Maximum particle diameter

• Particle size tolerance

• Adhesive chemistry

• Adhesive viscosity

• Dispensing method

• Assembly pressure

• Operating conditions

A controlled particle size distribution is recommended when repeatable large-gap control is required.

Custom Spacer Microspheres

SHBC can customize spacer microspheres according to project requirements.

Customization options may include:

• Custom particle diameter

• Particle size tolerance

• Particle size distribution

• Solid content

• Dispersion medium

• Surface treatment

• Dry powder or suspension

• Custom packaging

• OEM and ODM supply

Please provide the target gap, adhesive system, application and required quantity when requesting customization.

Quality Control and Documents

SHBC applies controlled manufacturing and batch inspection to support consistent product quality.

Available documents may include:

• Certificate of Analysis

• Technical Data Sheet

• Safety Data Sheet

• Particle size test report

• Particle size distribution data

• Batch inspection record

• Customized specification sheet

Why Choose SHBC?

Shanghai SanYu Biotechnology Co., Ltd. supplies polymer microspheres, silica microspheres, magnetic beads and functional microsphere materials.

SHBC provides:

• Precision particle manufacturing

• Stable batch-to-batch quality

• Multiple particle-size options

• Customized specifications

• Sample evaluation support

• Pilot-scale production

• Bulk manufacturing capability

• OEM and ODM services

Frequently Asked Questions

What are PAPS500UM microspheres?

PAPS500UM are nominal 500 μm polystyrene microspheres designed for large-gap and bond-line thickness control.

What are 500um spacer microspheres used for?

They can be evaluated for adhesive bonding, optical components, sensors, electronic modules, enclosures and industrial assembly.

Can PAPS500UM create an exact 500 μm gap?

The nominal diameter helps control the gap. Final thickness also depends on particle size distribution, adhesive properties, loading and assembly pressure.

Can PAPS500UM be mixed into epoxy adhesives?

Yes. PAPS500UM can be evaluated in compatible epoxy, UV-curable adhesive, silicone, sealant and other polymer systems.

Can PAPS500UM pass through a dispensing nozzle?

The dispensing nozzle and material path must be larger than the particle diameter. Equipment compatibility should be confirmed before use.

How much PAPS500UM should be added?

The recommended concentration depends on the bonding area, adhesive volume, viscosity and required support-point density.

Will the microspheres affect adhesive performance?

Particle loading and dispersion may influence adhesive flow, dispensing and bond strength. Compatibility testing is recommended.

Can SHBC customize the specifications?

Yes. Particle diameter, size tolerance, solid content, dispersion medium, supply form and packaging can be customized.

Are samples and bulk quantities available?

Yes. SHBC supports laboratory samples, pilot orders and long-term bulk supply.

Request a Sample or Quotation

Contact SHBC for PAPS500UM samples, technical specifications, custom spacer microspheres and bulk pricing.

Please provide:

• Target application

• Required gap thickness

• Adhesive or carrier system

• Required quantity

• Preferred supply form

• Packaging requirements

• Estimated annual demand

Product: 500um Spacer PS Microspheres
Catalog Number: PAPS500UM
Material: Polystyrene, PS
Nominal Particle Size: 500 μm
Brand: SHBC
Manufacturer: Shanghai SanYu Biotechnology Co., Ltd.